Semiconductor Industry

Kalrez^® 9100

An amber translucent product targeted specifically for deposition process applications, i.e. HDPCVD, PECVD, SACVD, Metal CVD, ALD, etc.

Temperature Range
25–180 °C

Kalrez^® 9300

A brown product for all etch processes. It has been specifically designed for use in applications where the plasma environment is a combination of ions and radicals.

Temperature Range
25–200 °C

Kalrez^® 9500

A tan product targeted specifically for deposition processes where ozone is used for processing. It has been specifically designed for use in applications where the plasma environment is more “chemical”.

Temperature Range
25–250 °C

Kalrez^® 8002

A clear, transparent product targeted for “select” plasma process applications, i.e. deposition, etching, ashing/stripping.

Temperature Range
25–250 °C

Kalrez^® Sahara ^™ 8085

A beige, general purpose product for etching, ashing/stripping and deposition process applications, i.e. HDPCVD, PECVD, and SACVD.

Temperature Range
25–250 °C

Kalrez^® 8900

A black product that has been specifically developed for semiconductor thermal processes, i.e. oxidation, diffusion furnace, metal CVD, ALD, and LPCVD.

Temperature Range
25–250 °C

Kalrez^® Sahara^™ 8475

A white product specifically developed to meet the challenging requirements associated with sealing applications in semiconductor thermal processes, i.e. oxidation, diffusion, furnace, LPCVD, RTP and lamp anneal.

Temperature Range
150–300 °C

Kalrez^® 6375UP

A black product for wet process applications. This product exhibits excellent chemical resistance to all types of wet process chemicals, acids and bases.

Kalrez^® Bonded Door Seals

Available in 9100, 8002 and Sahara® 8085, these seals significantly improve both particle generation and sealing performance over conventional o-rings for etching, ashing/stripping, HDPCVD, PECVD, SACVD, Metal CVD, and ALD wafer processing applications.

Kalrez^® 8575

A white product for “select” etch, ash/strip and deposition process applications. It offers very low weight loss in oxygen and fluorine-based plasmas, low outgassing, and excellent elastic recovery properties.

Temperature Range
150–300 °C

Kalrez^® 8705

perfluoroelastomer parts are primarily designed for seal locations in the direct path of high energy ultraviolet (UV) radiation emitted from a conventional light source or from plasma

Temperature Range
310°C 590°F

Kalrez^® 9600

perfluoroelastomer parts are designed for high purity, high temperature vacuum applications where seals are exposed to damaging Fluorine and Oxygen plasma radicals..

Temperature Range
315°C 600°F

Kalrez^® 7075UP

perfluoroelastomer parts are a black product targeted specifically metal CVD applications. It offers outstanding thermal stability, very low outgassing and excellent compression set properties.

Temperature Range
327°C 620°F

Kalrez^® W240

perfluoroelastomer parts are a black product for photovoltaic wet manufacturing processes requiring a wide range of chemical resistance.

Temperature Range
230 °C

Kalrez^® Plasma Processes

perfluoroelastomer parts have been used successfully in highly aggressive sealing environments for more than 40 years.

Temperature Range
250 °C – 300 °C

Kalrez^® Thermal Processes

perfluoroelastomer parts have been used successfully in highly aggressive sealing environments for more than 40 years.

Temperature Range
200 °C – 300 °C

Kalrez^® Wet Processes

perfl uoroelastomer parts have been used successfully in highly aggressive sealing environments for over 40 years.

Temperature Range
70 °C – 125 °C